This work is aimed to design and fabricate a prototype lab scale plasma sputtering machine for enhancement of research and development on thin film using in energy technologies. The prototype machine fabricated with dimension of 50 cm width, 50 cm length, and 100 cm height. The vacuum coating chamber with dimension of 42 cm width, 42 cm length, and 42 cm height made of stainless type 304 was installed at the top of the machine. The coating chamber volume is approximately about 26,000 cm3.The coating chamber cover made of clear acrylic. A cylinder cathode magnetron made of aluminum with dimeter of 10.0 cm was in installed at the middle of the coating chamber. The magnate was placed at the top of a magnetron for acceleration and control the direction of the particles in the plasma. The copper target with dimension of 11 cm width, 11 cm length, and 0.2 cm depth was attached the magnate. It used as a coating material. The substrate holder used as an anode. It was designed for install the substrate such as slide glass or some another thin materials that use for coating object. A 1.20 HP (900 W) rotary vacuum pump controlled with solenoid vacuum valve was placed at the bottom of the coating chamber, it used to maintain the sputtering pressure about 10-5 mbar to 10-6 mbar. According to our team objective, the DC power supply was fabricated from simple equipment that can buy in Thailand. It consisted of a variable voltage transformer, a bridge full wave rectifier circuit, a step-up transformer and two capacitors. From testing DC power supply with input voltage in the range of 25 VAC to 200 VAC, the voltage output is about 200 VDC to 1,800 VDC that enough for generating the stable plasma. The generated plasma inside the coating chamber appeared three types. The first type is glow discharge that make the complete sputtering process. The second and third type are glow discharge with arc discharge and only arc discharge. They are unstable plasma that make bad process. Morphology of copper film coated on glass microscope slides at different input voltages of 50, 75 and 100 VAC for 10, 20 and 30 min were determined by Scanning Electron Microscope (SEM). The results showed that the prototype could coat copper ion onto the surface of glass microscope slides for all treatments. The thickness of thin copper film in this study was in the range of nanometer that was similar to that of thin copper film coated by foreign machine. For electrical resistance, it was found that glass microscope slide coated with thin copper film provided higher electrical conductivity when increased input voltage above 75 VAC. The lowest electrical resistance was obtained at 3.0 ? when the glass microscope slides was coated at input voltage of 100 VAC for 30 min. Based on the results, it could be concludedthat the prototype plasma sputtering machine with the size of lab scale produced in this study effectively worked for enhancing the research and developing thin films in the future energy technology.